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Effect of Slurry Chemistry on Electrochemical Friction Behavior During Cu CMP
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 박진구 | - |
| dc.date.accessioned | 2021-06-23T05:29:36Z | - |
| dc.date.available | 2021-06-23T05:29:36Z | - |
| dc.date.issued | 2004-03-01 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/30732 | - |
| dc.title | Effect of Slurry Chemistry on Electrochemical Friction Behavior During Cu CMP | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 2004 AVS 5th International Conference on Microelectronics and Interfaces | - |
| dc.citation.conferencePlace | Santa Clara, CA | - |
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Related Researcher
- Park, Jin Goo
- ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)