A 50-MHz Fully Integrated Low-Swing Buck Converter Using Packaging Inductors
- Authors
- Ahn, Youngkook; Nam, Hyunseok; Roh, Jeongjin
- Issue Date
- Oct-2012
- Publisher
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
- Keywords
- Bonding wire; fully integrated dc-dc converter; lead frame; low-swing gate driver; packaging inductor
- Citation
- IEEE TRANSACTIONS ON POWER ELECTRONICS, v.27, no.10, pp.4347 - 4356
- Indexed
- SCIE
SCOPUS
- Journal Title
- IEEE TRANSACTIONS ON POWER ELECTRONICS
- Volume
- 27
- Number
- 10
- Start Page
- 4347
- End Page
- 4356
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/31816
- DOI
- 10.1109/TPEL.2012.2192136
- ISSN
- 0885-8993
- Abstract
- Implementation of on-chip passive elements and efficient regulation schemes are key aspects of fully integrated dc-dc converter design. This paper presents a 50-MHz fully integrated buck converter equipped with packaging inductors. These inductors include parasitic inductances of the bonding wires and lead frames in the package. They have significantly better Q factors than the best on-chip inductors implemented on silicon. This paper also presents full-swing and low-swing gate drivers for efficient regulation of high-frequency switching converters. The low-swing driver uses the drop voltage of a diode-connected transistor and is applied in a fabricated converter to reduce the gate driving loss caused by the high switching operation. The proposed converter is designed and fabricated using a 0.13-mu m 1-poly 6-metal CMOS process. The fully integrated buck converter achieves 68.7% and 76.8% efficiency for 3.3 V/2.0 V and 2.5 V/1.8 V conversions, respectively, while providing a load current of 250 mA.
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