Electrokinetic analysis of slurry particles and wafer surfaces and their interactions relevant to post cmp cleaning.

Abstract

THE purpose of this study was to explore the interaction betwwen slurry particles and wafer surfaces by the measurements of their zeta potentials. the zeta potentials of slurry particles such as fumed and colloidal silica,aluminum and substrates such as silicon, TEOS,W,and Cu have been measured by electrophoretic and electroosmosis method to evaluate the electrical properties of these surfaces, respectively. the zeta potential of oxide and metal surfaces showed similar values to those of particles as a function og PH. the interaction energy between particles and TEOS,W,A;,and,Cu substrates was calculates based on DLVO theory. no deposition of silica particles were observed in the particles deposition test. experimental result were well agreed with the theoretical calculation.