Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Semipermanent Copper Nanowire Network with an Oxidation-Proof Encapsulation Layer
- Authors
- Hong, Insic; Roh, Yeonwook; Koh, Je-Sung; Na, Seonyeob; Kim, Taewi; Lee, Eunhan; An, Hyeongi; Kwon, Jinhyeong; Yeo, Junyeob; Hong, Sukjoon; Lee, Kyu-Tae; Kang, Daeshik; Ko, Seung Hwan; Han, Seungyong
- Issue Date
- Apr-2019
- Publisher
- WILEY
- Keywords
- copper nanowires; CuPSP structures; flexible microheaters; oxidation
- Citation
- ADVANCED MATERIALS TECHNOLOGIES, v.4, no.4, pp 1 - 7
- Pages
- 7
- Indexed
- SCIE
SCOPUS
- Journal Title
- ADVANCED MATERIALS TECHNOLOGIES
- Volume
- 4
- Number
- 4
- Start Page
- 1
- End Page
- 7
- ISSN
- 2365-709X
- Abstract
- Copper nanowires (Cu NWs) have gained attention as an alternative to noble metal nanowires due to their affordable price, but their susceptibility to rapid oxidization in ambient conditions has remained a critical limitation for their practical usage. Many studies have been conducted to address this disadvantage but have been successful only in terms of oxidation prevention at certain temperatures, leaving the matter of oxidation at high temperatures unresolved. In this article, a simple encapsulation structure made of a polyimide and SiOx thin film is presented that effectively prevents the penetration of oxygen and moisture into the Cu NW network. This structure, furthermore, boasts excellent stability at high temperature (approximate to 350 degrees C) and in underwater, acidic chemical, and abrasive conditions.
- Files in This Item
- Go to Link
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
Related Researcher
- Hong, Suk Joon
- ERICA 공학대학 (DEPARTMENT OF MECHANICAL ENGINEERING)