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패키지의 주파수 의존형 파워 및 그라운드 평판 모델링

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dc.contributor.author어영선-
dc.date.accessioned2021-06-23T08:10:58Z-
dc.date.available2021-06-23T08:10:58Z-
dc.date.issued1999-06-01-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/34063-
dc.description.abstractA new frequency-variant equivalent circuit model of power/ground plane is presented. The equivalent circuit is modeled with grid cells. The circuit parameters of each cell were extracted by using Fasthenry. To verify the developed circuit model, its s-parameters are compared with the measured s-parameters[2] and the full-wave simulation-based s-parameters. Consequently, it is shown that our frequency-variant equivalent circuit model can accurately predict imperfect ground effects under the high frequency operation of electronic package-
dc.title패키지의 주파수 의존형 파워 및 그라운드 평판 모델링-
dc.typeConference-
dc.citation.conferenceName전자공학회 하계 학술대회-
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COLLEGE OF ENGINEERING SCIENCES > SCHOOL OF ELECTRICAL ENGINEERING > 2. Conference Papers

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EO, YUNG SEON
ERICA 공학대학 (SCHOOL OF ELECTRICAL ENGINEERING)
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