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복잡한 다층구조 IC 패키지의 회로 모델링 및 스위칭 노이즈 분석
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 어영선 | - |
| dc.date.accessioned | 2021-06-23T08:12:29Z | - |
| dc.date.available | 2021-06-23T08:12:29Z | - |
| dc.date.issued | 1998-11-21 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/34205 | - |
| dc.description.abstract | A new simplified circuit model for the switching noise analysis of the complicated multi-layer IC package is developed. The current flowing mechanism on the ground and power planes of the package is simplified by using the dependent current sources and partial plane circuit model. | - |
| dc.title | 복잡한 다층구조 IC 패키지의 회로 모델링 및 스위칭 노이즈 분석 | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 대한전자공학회 추계 학술대회 | - |
| dc.citation.conferencePlace | 경북대 | - |
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Related Researcher
- EO, YUNG SEON
- ERICA 공학대학 (SCHOOL OF ELECTRICAL ENGINEERING)