Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
습식 증착법( Electroless / Electrodeposition )을 이용한 실리콘(c-Si) 표면 박리 방법
Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 유봉영[유봉영] | - |
| dc.date.accessioned | 2021-06-23T08:40:54Z | - |
| dc.date.available | 2021-06-23T08:40:54Z | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/34818 | - |
| dc.title | 습식 증착법( Electroless / Electrodeposition )을 이용한 실리콘(c-Si) 표면 박리 방법 | - |
| dc.title.alternative | LIFT-OFF METHOD FOR SILICONE SUBSTRATE | - |
| dc.type | Patent | - |
| dc.contributor.affiliatedAuthor | 유봉영[유봉영] | - |
| dc.type.rims | PAT | - |
| dc.type.iprs | 특허 | - |
- Files in This Item
- There are no files associated with this item.
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
Related Researcher
- Yoo, Bong young
- ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)