Selection and Optimization of Corrosion Inhibitors for Improved Cu CMP and Post-Cu CMP Cleaning
DC Field | Value | Language |
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dc.contributor.author | Ryu, Heon-Yul | - |
dc.contributor.author | Cho, Byoung-Jun | - |
dc.contributor.author | Yerriboina, Nagendra Prasad | - |
dc.contributor.author | Lee, Chan-Hee | - |
dc.contributor.author | Hwang, Jun-Kil | - |
dc.contributor.author | Hamada, Satomi | - |
dc.contributor.author | Wada, Yutaka | - |
dc.contributor.author | Hiyama, Hirokuni | - |
dc.contributor.author | Park, Jin-Goo | - |
dc.date.accessioned | 2021-06-22T10:22:26Z | - |
dc.date.available | 2021-06-22T10:22:26Z | - |
dc.date.created | 2021-01-21 | - |
dc.date.issued | 2019-02 | - |
dc.identifier.issn | 2162-8769 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/3481 | - |
dc.description.abstract | Corrosion inhibitors play a key role in obtaining global planarization and protecting against corrosion during copper CMP. However, these inhibitors leave organic residues and increase particle contamination after the CMP process, which can directly affect the device yield. Cu CMP is usually performed with a slurry containing silica particles and a BTA corrosion inhibitor. High levels of organic defects and particle contamination are produced due to the high concentration of BTA used to meet CMP requirements. In this work a suitable corrosion inhibitor, 5-methyl-benzotriazole (MBTA), is proposed and used at an optimized concentration to remove organic residues and particle contamination effectively during the post-CMP process. The optimum inhibitor concentration was estimated for BTA and MBTA. Based on etching and EIS studies, it was found that a lower concentration of MBTA (relative to BTA) is needed to provide the conditions required for CMP. The passivation layer formed by MBTA can be removed easily during the post-CMP process. Thus, our results indicate that it is possible to reduce the concentration of the inhibitor while maintaining the same corrosion inhibition efficiency, thereby reducing the particle and organic defect levels. (C) The Author(s) 2019. Published by ECS. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | Electrochemical Society, Inc. | - |
dc.title | Selection and Optimization of Corrosion Inhibitors for Improved Cu CMP and Post-Cu CMP Cleaning | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Park, Jin-Goo | - |
dc.identifier.doi | 10.1149/2.0101905jss | - |
dc.identifier.scopusid | 2-s2.0-85072026084 | - |
dc.identifier.wosid | 000459244400001 | - |
dc.identifier.bibliographicCitation | ECS Journal of Solid State Science and Technology, v.8, no.5, pp.P3058 - P3062 | - |
dc.relation.isPartOf | ECS Journal of Solid State Science and Technology | - |
dc.citation.title | ECS Journal of Solid State Science and Technology | - |
dc.citation.volume | 8 | - |
dc.citation.number | 5 | - |
dc.citation.startPage | P3058 | - |
dc.citation.endPage | P3062 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | MECHANICAL PLANARIZATION | - |
dc.subject.keywordPlus | COPPER CORROSION | - |
dc.subject.keywordPlus | BENZOTRIAZOLE | - |
dc.subject.keywordPlus | IMPEDANCE | - |
dc.subject.keywordPlus | SLURRY | - |
dc.subject.keywordPlus | SPECTROSCOPY | - |
dc.subject.keywordPlus | TOLYTRIAZOLE | - |
dc.subject.keywordPlus | ALLOYS | - |
dc.subject.keywordPlus | FILMS | - |
dc.subject.keywordPlus | WATER | - |
dc.subject.keywordAuthor | Microelectronics - Semiconductor Processing | - |
dc.subject.keywordAuthor | Corrosion inhibitor | - |
dc.subject.keywordAuthor | Particle removal | - |
dc.subject.keywordAuthor | Post-CMP | - |
dc.identifier.url | https://iopscience.iop.org/article/10.1149/2.0101905jss | - |
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