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구리와 니켈의 하이브리드 구조를 이용한 관통 실리콘 비아 전극의형성방법
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 유봉영[유봉영] | - |
| dc.date.accessioned | 2021-06-23T08:41:09Z | - |
| dc.date.available | 2021-06-23T08:41:09Z | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/34841 | - |
| dc.title | 구리와 니켈의 하이브리드 구조를 이용한 관통 실리콘 비아 전극의형성방법 | - |
| dc.title.alternative | Fabrication of TSV with electrodeposited Cu and Ni | - |
| dc.type | Patent | - |
| dc.contributor.affiliatedAuthor | 유봉영[유봉영] | - |
| dc.type.rims | PAT | - |
| dc.type.iprs | 특허 | - |
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Related Researcher
- Yoo, Bong young
- ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)