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입자충진과 도금공정을 이용한 TSV(Through-Si-Via) 형성
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 좌용호[좌용호] | - |
| dc.contributor.author | 유봉영[유봉영] | - |
| dc.date.accessioned | 2021-06-23T08:41:14Z | - |
| dc.date.available | 2021-06-23T08:41:14Z | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/34849 | - |
| dc.title | 입자충진과 도금공정을 이용한 TSV(Through-Si-Via) 형성 | - |
| dc.title.alternative | Formation of TSV with nanopowder sintering and electrochemical deposition | - |
| dc.type | Patent | - |
| dc.contributor.affiliatedAuthor | 좌용호[좌용호] | - |
| dc.contributor.affiliatedAuthor | 유봉영[유봉영] | - |
| dc.type.rims | PAT | - |
| dc.type.iprs | 특허 | - |
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Related Researcher
- Yoo, Bong young
- ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)