Optimization of dispersant-free colloidal ink droplets for inkjet patterning without the coffee-ring effect using 1-octanethiol-coated copper nano-ink with a Standard Clean-1-treated substrate
- Authors
- Son, Yeon-Ho; Kang, Min Kyu; Lee, Sunyong Caroline
- Issue Date
- Feb-2019
- Publisher
- Elsevier BV
- Keywords
- Inkjet-printed pattern; Droplets; Standard Clean-1; Antioxidized copper nano-ink
- Citation
- Materials Chemistry and Physics, v.223, pp 779 - 783
- Pages
- 5
- Indexed
- SCI
SCIE
SCOPUS
- Journal Title
- Materials Chemistry and Physics
- Volume
- 223
- Start Page
- 779
- End Page
- 783
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/3503
- DOI
- 10.1016/j.matchemphys.2018.11.064
- ISSN
- 0254-0584
1879-3312
- Abstract
- Inkjet-printed patterns and droplets were formed by the inkjet printing method on a Standard Clean-1 (SC-1)treated substrate using anti-oxidized copper nano-ink. The hydrophobicity of the substrate increased after the SC-1 treatment. Copper nanoparticles were coated with 1-octanethiol vapors via a dry coating method to produce anti-oxidized nanoparticles, which were dispersed in a solvent to form a nano-ink. Droplets of the 1octanethiol-coated copper nano-ink at 50 wt% concentration had a uniform morphology when printed on the SC-1-treated glass substrate. The minimum printed pattern line width was 55 mu m on the SC-1-treated glass and had a resistivity of 1.73 x 10(-7)Omega m. This resistivity was 4.3-times lower than that of the untreated substrate. Moreover, the pattern printed using the nano-ink made with 1-octanethiol-coated copper nanoparticles showed good adhesion and provided approximately 2.1-times lower resistivity. The dispersion of the nanoparticles within the droplet was more hydrophobic and formed uniform inkjet-printed patterns that had lower resistivity compared with those made with the uncoated nanoparticle-containing ink.
- Files in This Item
-
Go to Link
- Appears in
Collections - COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING > 1. Journal Articles

Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.