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CMP 공정에서 Slurry particle과 Wafer표면간의 상호작용에 대한 연구
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 박진구 | - |
| dc.date.accessioned | 2021-06-23T08:57:29Z | - |
| dc.date.available | 2021-06-23T08:57:29Z | - |
| dc.date.issued | 1997-11-01 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/35260 | - |
| dc.title | CMP 공정에서 Slurry particle과 Wafer표면간의 상호작용에 대한 연구 | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 한국재료학회 추계학술대회 | - |
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Related Researcher
- Park, Jin Goo
- ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)