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화학적 기계 연마를 적용한 실리콘 나노 구조체 조절 및 이를 이용한 쇼트키 접합 특성 개선Improved schottky junction on Si nanostructures by using chemical-mechanical polishing (CMP) process
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- Improved schottky junction on Si nanostructures by using chemical-mechanical polishing (CMP) process
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- 이정호[이정호]
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- Lee, Jung-Ho
- ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)