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Pulsed light sintering characteristics of inkjet-printed nanosilver films on a polymer substrate

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dc.contributor.authorLee, Dong Jun-
dc.contributor.authorPark, Sung Hyeon-
dc.contributor.authorJang, Shin-
dc.contributor.authorKim, Hak Sung-
dc.contributor.authorOh, Je Hoon-
dc.contributor.authorSong, Yong Won-
dc.date.accessioned2021-06-23T10:04:12Z-
dc.date.available2021-06-23T10:04:12Z-
dc.date.created2021-01-21-
dc.date.issued2011-12-
dc.identifier.issn0960-1317-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/36365-
dc.description.abstractIn this work, the microstructures of inkjet-printed nanosilver films sintered by intense pulsed light (IPL) were systematically analyzed and correlated with the electrical properties. Nanosilver films with various dimensions were inkjet-printed and sintered at different light intensities to investigate the effects of the film dimension and light intensity on the sintering characteristics. For comparison purposes, the same inkjet-printed films were also thermally sintered at 210 degrees C for 1 h. Consecutive light pulses from a xenon lamp induced film swelling and the corresponding hollow microstructures of the inkjet nanosilver films. The resistance of IPL-sintered films was inversely proportional to the light intensity, and the resultant conductivity comparable to the thermally sintered one was achieved within just a few tens of ms, without damaging a polymer substrate. While all the thermally sintered patterns experienced shrinkage during the sintering process, the IPL-sintered ones could keep their initial dimension at a certain light intensity.-
dc.language영어-
dc.language.isoen-
dc.publisherIOP PUBLISHING LTD-
dc.titlePulsed light sintering characteristics of inkjet-printed nanosilver films on a polymer substrate-
dc.typeArticle-
dc.contributor.affiliatedAuthorOh, Je Hoon-
dc.identifier.doi10.1088/0960-1317/21/12/125023-
dc.identifier.scopusid2-s2.0-84855459765-
dc.identifier.wosid000298080100023-
dc.identifier.bibliographicCitationJOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.21, no.12, pp.1 - 7-
dc.relation.isPartOfJOURNAL OF MICROMECHANICS AND MICROENGINEERING-
dc.citation.titleJOURNAL OF MICROMECHANICS AND MICROENGINEERING-
dc.citation.volume21-
dc.citation.number12-
dc.citation.startPage1-
dc.citation.endPage7-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaScience & Technology - Other Topics-
dc.relation.journalResearchAreaInstruments & Instrumentation-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryNanoscience & Nanotechnology-
dc.relation.journalWebOfScienceCategoryInstruments & Instrumentation-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.subject.keywordPlusNANOPARTICLES-
dc.subject.keywordAuthorNANOPARTICLES-
dc.subject.keywordAuthorTEMPERATURE-
dc.subject.keywordAuthorAG LINES-
dc.subject.keywordAuthorFUTURE-
dc.subject.keywordAuthorELECTRONICS-
dc.subject.keywordAuthorINKS-
dc.identifier.urlhttps://iopscience.iop.org/article/10.1088/0960-1317/21/12/125023-
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