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Thermal stability of stuffed TiN/Tidiffusion barriers formed underdifferrnt thermol history withAi:1% Si everlayers and Si substrates
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 오재응 | - |
| dc.date.accessioned | 2021-06-23T11:09:48Z | - |
| dc.date.available | 2021-06-23T11:09:48Z | - |
| dc.date.created | 2020-12-17 | - |
| dc.date.issued | 1992-01-01 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/38466 | - |
| dc.publisher | 대한 전자 공학회 | - |
| dc.title | Thermal stability of stuffed TiN/Tidiffusion barriers formed underdifferrnt thermol history withAi:1% Si everlayers and Si substrates | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 오재응 | - |
| dc.identifier.bibliographicCitation | 전자 공학회 춘계 학술대회 | - |
| dc.relation.isPartOf | 전자 공학회 춘계 학술대회 | - |
| dc.citation.title | 전자 공학회 춘계 학술대회 | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 2 | - |
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