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Thermal stability of stuffed TiN/Tidiffusion barriers formed underdifferrnt thermol history withAi:1% Si everlayers and Si substrates
- Authors
- 오재응
- Issue Date
- 1-Jan-1992
- Publisher
- 대한 전자 공학회
- Citation
- 전자 공학회 춘계 학술대회
- Conference Name
- 전자 공학회 춘계 학술대회
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