Sintering Mechanism of Vapor Self-Assembled Multilayer (VSAM) Coated Cu Nano Particles for Application in Cu Nano Ink
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Mominul Haque | - |
dc.contributor.author | Shin Young Park | - |
dc.contributor.author | Jaehak Her | - |
dc.contributor.author | Joong-hak Park | - |
dc.contributor.author | 이선영 | - |
dc.date.accessioned | 2021-06-23T11:39:30Z | - |
dc.date.available | 2021-06-23T11:39:30Z | - |
dc.date.created | 2021-01-22 | - |
dc.date.issued | 2011-09 | - |
dc.identifier.issn | 1738-8090 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/38844 | - |
dc.description.abstract | Oxidation preventive Cu nano ink was prepared using a vapor self-assembly multi-layer coating method (VSAMs). These particles were prepared using 100 nm Cu nano particles coated with 1-octanethiol under an ultrahigh vacuum condition with octanol used as a solvent. Octanol-based non-oxidized 10% (wt.) nano ink was well-dispersed without any surfactant. The conductive ink had good dispersion and remains stable for more than weeks. It also has a low viscosity rating of 8.3 cPs. In addition, 5 μL of copper nano ink was dropped into a 1 cm x 1 cm glass substrate to form a copper pattern. The copper pattern was then sintered at 350°C in a tube furnace in a H2 gas atmosphere. The resistivity of the film using the fabricated ink was determined to be 5.8 × 10^(−6) Ωcm. The results show that the non-oxidized oxidation-preventive copper nano ink is suitable for ink-jet printing. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | 대한금속·재료학회 | - |
dc.title | Sintering Mechanism of Vapor Self-Assembled Multilayer (VSAM) Coated Cu Nano Particles for Application in Cu Nano Ink | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | 이선영 | - |
dc.identifier.doi | 10.1007/s13391-011-0903-3 | - |
dc.identifier.scopusid | 2-s2.0-80054100034 | - |
dc.identifier.wosid | 000296202600003 | - |
dc.identifier.bibliographicCitation | Electronic Materials Letters, v.7, no.3, pp.195 - 199 | - |
dc.relation.isPartOf | Electronic Materials Letters | - |
dc.citation.title | Electronic Materials Letters | - |
dc.citation.volume | 7 | - |
dc.citation.number | 3 | - |
dc.citation.startPage | 195 | - |
dc.citation.endPage | 199 | - |
dc.type.rims | ART | - |
dc.identifier.kciid | ART001608622 | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.description.journalRegisteredClass | kci | - |
dc.description.journalRegisteredClass | other | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.subject.keywordPlus | Copper | - |
dc.subject.keywordPlus | Dispersions | - |
dc.subject.keywordPlus | Octanols | - |
dc.subject.keywordPlus | Oxidation | - |
dc.subject.keywordPlus | Resistivity | - |
dc.subject.keywordPlus | Sintering | - |
dc.subject.keywordPlus | Substrates | - |
dc.subject.keywordPlus | Surfactants | - |
dc.subject.keywordPlus | Vapors | - |
dc.subject.keywordPlus | Viscosity | - |
dc.subject.keywordAuthor | octanethiol | - |
dc.subject.keywordAuthor | Cu nanoparticle | - |
dc.subject.keywordAuthor | prevent oxidation | - |
dc.subject.keywordAuthor | octanol | - |
dc.subject.keywordAuthor | VSAM | - |
dc.identifier.url | https://link.springer.com/article/10.1007%2Fs13391-011-0903-3 | - |
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