Sintering Mechanism of Vapor Self-Assembled Multilayer (VSAM) Coated Cu Nano Particles for Application in Cu Nano Ink
- Authors
- Mominul Haque; Shin Young Park; Jaehak Her; Joong-hak Park; 이선영
- Issue Date
- Sep-2011
- Publisher
- 대한금속·재료학회
- Keywords
- octanethiol; Cu nanoparticle; prevent oxidation; octanol; VSAM
- Citation
- Electronic Materials Letters, v.7, no.3, pp.195 - 199
- Indexed
- SCIE
SCOPUS
KCI
OTHER
- Journal Title
- Electronic Materials Letters
- Volume
- 7
- Number
- 3
- Start Page
- 195
- End Page
- 199
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/38844
- DOI
- 10.1007/s13391-011-0903-3
- ISSN
- 1738-8090
- Abstract
- Oxidation preventive Cu nano ink was prepared using a vapor self-assembly multi-layer coating method (VSAMs). These particles were prepared using 100 nm Cu nano particles coated with 1-octanethiol under an ultrahigh vacuum condition with octanol used as a solvent. Octanol-based non-oxidized 10% (wt.) nano ink was well-dispersed without any surfactant. The conductive ink had good dispersion and remains stable for more than weeks. It also has a low viscosity rating of 8.3 cPs. In addition, 5 μL of copper nano ink was dropped into a 1 cm x 1 cm glass substrate to form a copper pattern. The copper pattern was then sintered at 350°C in a tube furnace in a H2 gas atmosphere. The resistivity of the film using the fabricated ink was determined to be 5.8 × 10^(−6) Ωcm. The results show that the non-oxidized oxidation-preventive copper nano ink is suitable for ink-jet printing.
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