Fabrication of Stainless Steel Metal Mask with Electrochemical Fabrication Method and Its Improvement in Dimensional Uniformity

Abstract

This study presents an efficient method for fabricating a stainless-steel metal mask with through hole arrays. The electrochemical interactions between the electrolyte and metal surface were analyzed by linear scan voltammetry (LSV) and electrochemical impedance spectroscopy (EIS). Dry film resist patterning was utilized to apply a protective layer to the substrate for selective electrochemical etching. Through hole arrays were fabricated by electrochemical fabrication, which entails immersing two electrodes in an electrolyte and applying current. To improve the dimensional uniformity of the resulting through hole arrays, ammonium dodecyl sulfate (ADS) was added to the electrolyte and an insulation shield was placed in front of the substrate. Confocal 3D microscopy and optical microscopy were used to evaluate the dimensional uniformity and the depth and radius of hole patterns, respectively. LSV and EIS results showed that the stainless-steel surface was passivated at a low potential and that the passivation layer was broken down at high potential. Adding ADS and the insulation shield improved the dimensional uniformity of the resulting through hole arrays. [GRAPHICS] .