Fine-Sized Etching of Flexible Substrates Using Nano Particle Deposition System (NPDS)

Abstract

Nano Particle Deposition System (NPDS) was used to etch flexible substrates, such as SU-8 and indium tin oxide (ITO) substrates using nickel powders using micronozzles. The stand-off distance (SOD) was changed in order to find out the optimal distance on etching behavior. The results showed that the etching capability was influenced by the SoD and the types of substrate. Especially, the etching depth of the substrate was the largest when the SoD was 500 mu m. This phenomenon related to the variation of SoD can be explained by the flow behavior at which the powder-gas mixture injected from the nozzle where the particles are most highly accelerated at that point. The etching capability is also affected by the types of substrates. Especially, the hardness of the substrate mainly determines the etching depth. The result suggests that the NPDS gives an alternative way of micromachining suitable for fine-sized etching on flexible substrates. [doi:10.2320/matertrans.M2010221]