Fabrication and Ink-Jet Patterning of Copper Nanoparticles with Improved Dispersion Stability
- Authors
- Lee, Kun-Jae; Kim, Namwoo; Hong, Sung-Jei; Lee, Kyu Bok; Lee, Dong-Jun; Oh, Je Hoon; Byun, Younghun; Choa, Yong-Ho
- Issue Date
- May-2010
- Publisher
- AMER SCIENTIFIC PUBLISHERS
- Keywords
- Ink-Jet Printing; Cu Nanoparticles; Conductive Ink; Electrochemical Reaction
- Citation
- JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.10, no.5, pp.3350 - 3353
- Indexed
- SCIE
SCOPUS
- Journal Title
- JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY
- Volume
- 10
- Number
- 5
- Start Page
- 3350
- End Page
- 3353
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/39855
- DOI
- 10.1166/jnn.2010.2307
- ISSN
- 1533-4880
- Abstract
- Copper (Cu) nanoparticles as the metal nanoparticles in the conductive ink were synthesized using electrochemical reaction. This method is characterized as the synthesis process without any metal salts and the post-treatment of washing and drying. It means that it does not need to consider about oxidized and agglomerated metal nanoparticles during the extra treatments. The Cu nanoparticles were synthesized in the various conditions of electrolyte to investigate the mechanism of the synthesis reaction of Cu nanoparticles. And also, the synthesized Cu nanoparticles were controlled the dispersion stability with the addition of dispersion agent such as PVP and Dextran. Finally, it was achieved the ink-jet printed Cu patterns using the synthesized Cu nanoparticles, and examined the morphology of the patterns.
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Collections - COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING > 1. Journal Articles
- COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MECHANICAL ENGINEERING > 1. Journal Articles
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