Compact CAD Models for the Signal Integrity Verification of Multi-Coupled Transmission Lines
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Hyunsik | - |
dc.contributor.author | Eo, Yungseon | - |
dc.date.accessioned | 2021-06-23T13:37:00Z | - |
dc.date.available | 2021-06-23T13:37:00Z | - |
dc.date.issued | 2010-04 | - |
dc.identifier.issn | 0916-8508 | - |
dc.identifier.issn | 1745-1337 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/39905 | - |
dc.description.abstract | A novel modal signal decoupling algorithm for multi-coupled transmission lines is developed Since the proposed method exploits a set of basis vectors associated with the characteristic impedances of the transmission line system, these multi-coupled signals can be efficiently decoupled regardless of dielectric media and conductors Thus, compact forms of the signal integrity verification CAD models for multi-coupled transmission lines can be readily determined It is shown that the analytical models are in excellent agreement with those obtained with SPICE simulation and its computation time is much faster than the conventional macro model (W-model) in the order of two | - |
dc.format.extent | 9 | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | Oxford University Press | - |
dc.title | Compact CAD Models for the Signal Integrity Verification of Multi-Coupled Transmission Lines | - |
dc.type | Article | - |
dc.publisher.location | 일본 | - |
dc.identifier.doi | 10.1587/transfun.E93.A.752 | - |
dc.identifier.scopusid | 2-s2.0-77950833110 | - |
dc.identifier.wosid | 000276848000011 | - |
dc.identifier.bibliographicCitation | IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences, v.E93A, no.4, pp 752 - 760 | - |
dc.citation.title | IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences | - |
dc.citation.volume | E93A | - |
dc.citation.number | 4 | - |
dc.citation.startPage | 752 | - |
dc.citation.endPage | 760 | - |
dc.type.docType | Article | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Computer Science | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalWebOfScienceCategory | Computer Science, Hardware & Architecture | - |
dc.relation.journalWebOfScienceCategory | Computer Science, Information Systems | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.subject.keywordPlus | SIMULATION | - |
dc.subject.keywordPlus | SINGLE | - |
dc.subject.keywordPlus | IMPACT | - |
dc.subject.keywordAuthor | crosstalk | - |
dc.subject.keywordAuthor | multi-coupled transmission lines | - |
dc.subject.keywordAuthor | signal integrity | - |
dc.subject.keywordAuthor | signal transient | - |
dc.subject.keywordAuthor | simulation | - |
dc.identifier.url | https://www.jstage.jst.go.jp/article/transfun/E93.A/4/E93.A_4_752/_article | - |
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