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Compact CAD Models for the Signal Integrity Verification of Multi-Coupled Transmission Lines

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dc.contributor.authorKim, Hyunsik-
dc.contributor.authorEo, Yungseon-
dc.date.accessioned2021-06-23T13:37:00Z-
dc.date.available2021-06-23T13:37:00Z-
dc.date.issued2010-04-
dc.identifier.issn0916-8508-
dc.identifier.issn1745-1337-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/39905-
dc.description.abstractA novel modal signal decoupling algorithm for multi-coupled transmission lines is developed Since the proposed method exploits a set of basis vectors associated with the characteristic impedances of the transmission line system, these multi-coupled signals can be efficiently decoupled regardless of dielectric media and conductors Thus, compact forms of the signal integrity verification CAD models for multi-coupled transmission lines can be readily determined It is shown that the analytical models are in excellent agreement with those obtained with SPICE simulation and its computation time is much faster than the conventional macro model (W-model) in the order of two-
dc.format.extent9-
dc.language영어-
dc.language.isoENG-
dc.publisherOxford University Press-
dc.titleCompact CAD Models for the Signal Integrity Verification of Multi-Coupled Transmission Lines-
dc.typeArticle-
dc.publisher.location일본-
dc.identifier.doi10.1587/transfun.E93.A.752-
dc.identifier.scopusid2-s2.0-77950833110-
dc.identifier.wosid000276848000011-
dc.identifier.bibliographicCitationIEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences, v.E93A, no.4, pp 752 - 760-
dc.citation.titleIEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences-
dc.citation.volumeE93A-
dc.citation.number4-
dc.citation.startPage752-
dc.citation.endPage760-
dc.type.docTypeArticle-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaComputer Science-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalWebOfScienceCategoryComputer Science, Hardware & Architecture-
dc.relation.journalWebOfScienceCategoryComputer Science, Information Systems-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.subject.keywordPlusSIMULATION-
dc.subject.keywordPlusSINGLE-
dc.subject.keywordPlusIMPACT-
dc.subject.keywordAuthorcrosstalk-
dc.subject.keywordAuthormulti-coupled transmission lines-
dc.subject.keywordAuthorsignal integrity-
dc.subject.keywordAuthorsignal transient-
dc.subject.keywordAuthorsimulation-
dc.identifier.urlhttps://www.jstage.jst.go.jp/article/transfun/E93.A/4/E93.A_4_752/_article-
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EO, YUNG SEON
ERICA 공학대학 (SCHOOL OF ELECTRICAL ENGINEERING)
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