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Geometrical characterization of inkjet-printed conductive lines of nanosilver suspensions on a polymer substrate

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dc.contributor.authorKang, Byung Ju-
dc.contributor.authorOh, Je Hoon-
dc.date.accessioned2021-06-23T13:37:46Z-
dc.date.available2021-06-23T13:37:46Z-
dc.date.created2021-01-21-
dc.date.issued2010-03-
dc.identifier.issn0040-6090-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/39935-
dc.description.abstractThe effect of droplet/substrate interactions on the geometrical characteristics such as shape and morphology of as-printed conductive lines of nanosilver suspensions was investigated by varying the surface energy, substrate temperature and droplet spacing. With a plasma surface treatment using a mixture of C4F8 and O-2 gases, various surface wettability conditions were obtained that could produce desired droplet diameters on the substrate from 30 mu m to 70 mu m. The substrate temperature varied from room temperature to 75 degrees C, and ink droplets ejected from a 30 mu m nozzle were printed with various overlaps from 10% to 60%. When printed at room temperature, continuous lines are not formed due to line instability issues such as merging of neighboring droplets and line bulges. By heating the substrates, continuous lines without bulges could be obtained on the relatively hydrophobic substrate because the heat flux from the substrate enhances the evaporation rate of the solvent. The coffee ring effect in the droplets and lines is more enhanced as the substrate temperature increases. This effect is weaker in the lines than in the single droplets due to less edge length in the lines. Under appropriate conditions, well-defined continuous lines could be printed without coffee rings. (C)2009 Elsevier B.V. All rights reserved.-
dc.language영어-
dc.language.isoen-
dc.publisherELSEVIER SCIENCE SA-
dc.titleGeometrical characterization of inkjet-printed conductive lines of nanosilver suspensions on a polymer substrate-
dc.typeArticle-
dc.contributor.affiliatedAuthorOh, Je Hoon-
dc.identifier.doi10.1016/j.tsf.2009.10.126-
dc.identifier.scopusid2-s2.0-76049119058-
dc.identifier.wosid000275920000056-
dc.identifier.bibliographicCitationTHIN SOLID FILMS, v.518, no.10, pp.2890 - 2896-
dc.relation.isPartOfTHIN SOLID FILMS-
dc.citation.titleTHIN SOLID FILMS-
dc.citation.volume518-
dc.citation.number10-
dc.citation.startPage2890-
dc.citation.endPage2896-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryMaterials Science, Coatings & Films-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.relation.journalWebOfScienceCategoryPhysics, Condensed Matter-
dc.subject.keywordPlusTRACKS-
dc.subject.keywordPlusLIQUID-
dc.subject.keywordPlusMORPHOLOGIES-
dc.subject.keywordPlusDROPS-
dc.subject.keywordAuthorInkjet printing-
dc.subject.keywordAuthorPlasma surface treatment-
dc.subject.keywordAuthorWettability-
dc.subject.keywordAuthorSurface morphology-
dc.subject.keywordAuthorLine instability-
dc.subject.keywordAuthorNanosilver suspension-
dc.subject.keywordAuthorContact angle-
dc.subject.keywordAuthorCoffee ring effect-
dc.identifier.urlhttps://www.sciencedirect.com/science/article/pii/S0040609009017933?via%3Dihub-
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ERICA 공학대학 (DEPARTMENT OF MECHANICAL ENGINEERING)
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