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SRAM cell reliability degradations due to cell crosstalk

Authors
Bae, JongsunBaeg, SanghyeonWen, ShijieWong, Rick
Issue Date
Oct-2010
Publisher
IEEE
Citation
IEEE International Integrated Reliability Workshop Final Report, pp 129 - 132
Pages
4
Indexed
SCOPUS
Journal Title
IEEE International Integrated Reliability Workshop Final Report
Start Page
129
End Page
132
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/40474
DOI
10.1109/IIRW.2010.5706505
ISSN
1930-8841
2374-8036
Abstract
The capacitance between adjacent SRAM cells due to defectivity can increase in smaller geometry technologies. However, the abnormal behaviors due to such defective capacitance in SRAM are often neglected and can cause NTF (No Trouble Found) failures. The effective testing or calibration methods for such capacitance due to defects are not easily available in today's manufacturing. In this paper, a 3-D field solver was used to see the potential ranges of the defective capacitance. The crosstalk AC current through the coupling capacitance, which is referred to as cell coupling capacitor (CCCP) is newly modeled as a current source to build modified SNM (Static Noise Margin). The two metrics, SNM and VDDMIN show that the reliability under the CCCP can be significantly degraded during memory operations. Even with a marginal CCCP, SNM variation is 40mV at a read operation and VDDMIN shift is 110mV at a write operation in a 65nm SRAM cell. © 2010 IEEE.
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ERICA 공학대학 (SCHOOL OF ELECTRICAL ENGINEERING)
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