Development of large area CoNi alloy electrodeposition process for stress free electroforming mold
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Jung Ki | - |
dc.contributor.author | Cho, Si Hyeong | - |
dc.contributor.author | Kang, Hyung Bum | - |
dc.contributor.author | Lim, Hyun Woo | - |
dc.contributor.author | Yoo, Bong Young | - |
dc.contributor.author | Park, Jin-Goo | - |
dc.date.accessioned | 2021-06-23T14:07:39Z | - |
dc.date.available | 2021-06-23T14:07:39Z | - |
dc.date.created | 2021-01-22 | - |
dc.date.issued | 2010 | - |
dc.identifier.issn | 1938-5862 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/40489 | - |
dc.description.abstract | A 140mm CoNi alloy stamp for NIL was fabricated from a nano Si mother mold by using stress free electroforming method. CoNi alloys were electrodeposited from cobalt-nickel chloride electrolyte to investigate the influence of flow velocity of plating solution on CoNi film stress. Co and Ni contents were able to be controlled by changing flow rates and bath concentration of CoCl 2. The stress was reduced to 0 in the solution containing 0.008M CoCl2 at the flow velocity of 1 to 2 m/s. The process allows deposition of stress free CoNi alloys. The multiple duplication of a CoNi alloy stamp is possible without the consumption of costly Si mother stamp. Duplicated patterns on CoNi alloy stamp were compared with those of Si mother mold by using field emission scanning electron microscopy (FE-SEM) and atomic force microscophy (AFM). ©The Electrochemical Society. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | Electrochemical Society, Inc. | - |
dc.title | Development of large area CoNi alloy electrodeposition process for stress free electroforming mold | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Yoo, Bong Young | - |
dc.contributor.affiliatedAuthor | Park, Jin-Goo | - |
dc.identifier.doi | 10.1149/1.3422501 | - |
dc.identifier.scopusid | 2-s2.0-79952748283 | - |
dc.identifier.wosid | 000313576800007 | - |
dc.identifier.bibliographicCitation | ECS Transactions, v.25, no.41, pp.77 - 86 | - |
dc.relation.isPartOf | ECS Transactions | - |
dc.citation.title | ECS Transactions | - |
dc.citation.volume | 25 | - |
dc.citation.number | 41 | - |
dc.citation.startPage | 77 | - |
dc.citation.endPage | 86 | - |
dc.type.rims | ART | - |
dc.type.docType | Conference Paper | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Electrochemistry | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalWebOfScienceCategory | Electrochemistry | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Coatings & Films | - |
dc.subject.keywordPlus | AFM | - |
dc.subject.keywordPlus | Atomic force | - |
dc.subject.keywordPlus | Bath concentrations | - |
dc.subject.keywordPlus | Co-Ni alloys | - |
dc.subject.keywordPlus | Cobalt-nickel | - |
dc.subject.keywordPlus | Field emission scanning electron microscopy | - |
dc.subject.keywordPlus | Film stress | - |
dc.subject.keywordPlus | Ni content | - |
dc.subject.keywordPlus | Plating solutions | - |
dc.subject.keywordPlus | Stress free | - |
dc.subject.keywordPlus | Chlorine compounds | - |
dc.subject.keywordPlus | Cobalt | - |
dc.subject.keywordPlus | Cobalt plating | - |
dc.subject.keywordPlus | Electrochemistry | - |
dc.subject.keywordPlus | Electrodeposition | - |
dc.subject.keywordPlus | Electroforming | - |
dc.subject.keywordPlus | Electrometallurgy | - |
dc.subject.keywordPlus | Field emission | - |
dc.subject.keywordPlus | Field emission microscopes | - |
dc.subject.keywordPlus | Flow velocity | - |
dc.subject.keywordPlus | Molds | - |
dc.subject.keywordPlus | Scanning electron microscopy | - |
dc.subject.keywordPlus | Silicon | - |
dc.subject.keywordPlus | Alloys | - |
dc.identifier.url | https://iopscience.iop.org/article/10.1149/1.3422501 | - |
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