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HoP-iPD 출력 매칭 회로를 적용한 2mm × 2mm 크기의 WCDMA 단말기용 마이크로파 전력 증폭기 개발
Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 유창 | - |
| dc.contributor.author | 김정현 | - |
| dc.date.accessioned | 2021-06-23T15:37:38Z | - |
| dc.date.available | 2021-06-23T15:37:38Z | - |
| dc.date.created | 2021-02-18 | - |
| dc.date.issued | 2009-06 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/41151 | - |
| dc.description.abstract | An ultra small form-factor power amplifier (PA) module was developed for WCDMA handset applications. To reduce the size of the PA module, the bulky transmission lines and lumped chip elements of the conventional output matching network (OMN) were replaced with the proposed helix-on-pad (HoP) and an integrated passive device (iPD), respectively. Using the proposed HoP-iPD OMN, a 2 mm x 2 mm single-band PA module was implemented for UMTS Band-5 applications without RF performance degradation. | - |
| dc.language | 한국어 | - |
| dc.language.iso | ko | - |
| dc.publisher | 한양대학교 공학기술연구소 | - |
| dc.title | HoP-iPD 출력 매칭 회로를 적용한 2mm × 2mm 크기의 WCDMA 단말기용 마이크로파 전력 증폭기 개발 | - |
| dc.type | Article | - |
| dc.contributor.affiliatedAuthor | 김정현 | - |
| dc.identifier.bibliographicCitation | 공학기술논문집, v.19, no. , pp.45 - 51 | - |
| dc.relation.isPartOf | 공학기술논문집 | - |
| dc.citation.title | 공학기술논문집 | - |
| dc.citation.volume | 19 | - |
| dc.citation.startPage | 45 | - |
| dc.citation.endPage | 51 | - |
| dc.type.rims | ART | - |
| dc.description.journalClass | 3 | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | other | - |
| dc.identifier.url | http://riet.hanyang.ac.kr/index.php?mid=journal&category=265&document_srl=274 | - |
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Related Researcher
- KIM, JUNG HYUN
- ERICA 공학대학 (SCHOOL OF ELECTRICAL ENGINEERING)