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High-Frequency Characterization and Circuit Modeling of Via in Multi-Layered IC Package
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 어영선 | - |
| dc.date.accessioned | 2021-06-23T15:40:21Z | - |
| dc.date.available | 2021-06-23T15:40:21Z | - |
| dc.date.created | 2021-02-18 | - |
| dc.date.issued | 2009-04 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/41304 | - |
| dc.description.abstract | A via is experimentally characterized by using highfrequency s-parameter measurements. Test patterns are designed and fabricated by using a package process. They are measured by using VNA (vector network analyzer) up to 25GHz. The parasitic effects due to access lines for on-wafer probing are deembedded. Then modeling the via as two equivalent circuits (Ttype and Pi-type), the circuit model parameters are determined. It is shown that the T-type circuit model has excellent agreement with the measured s-parameters. | - |
| dc.publisher | GSMM | - |
| dc.title | High-Frequency Characterization and Circuit Modeling of Via in Multi-Layered IC Package | - |
| dc.type | Article | - |
| dc.contributor.affiliatedAuthor | 어영선 | - |
| dc.identifier.bibliographicCitation | Global Symposium on Millimeter Waves 2009 | - |
| dc.relation.isPartOf | Global Symposium on Millimeter Waves 2009 | - |
| dc.citation.title | Global Symposium on Millimeter Waves 2009 | - |
| dc.type.rims | ART | - |
| dc.description.journalClass | 3 | - |
| dc.subject.keywordAuthor | s-parameter | - |
| dc.subject.keywordAuthor | de-embedding | - |
| dc.subject.keywordAuthor | circuit model | - |
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Related Researcher
- EO, YUNG SEON
- ERICA 공학대학 (SCHOOL OF ELECTRICAL ENGINEERING)