Adhesion force change on multilayer EUVL mask due to laser induced plasma shock wave
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Tae-Gon | - |
dc.contributor.author | Yoo, Young-Sam | - |
dc.contributor.author | Ahn, Jinho | - |
dc.contributor.author | Lee, Jong-Myoung | - |
dc.contributor.author | Choi, Jae-Sung | - |
dc.contributor.author | Busnaina, Ahmed A. | - |
dc.contributor.author | Park, Jin-Goo | - |
dc.date.accessioned | 2021-06-23T16:02:29Z | - |
dc.date.available | 2021-06-23T16:02:29Z | - |
dc.date.created | 2021-01-21 | - |
dc.date.issued | 2009-02 | - |
dc.identifier.issn | 0167-9317 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/41413 | - |
dc.description.abstract | Change in adhesion force between a borosilicate glass microsphere and 40 Al2O3/TaN/Ru/MoSi pairs on a silicon wafer used as a multilayer extreme ultraviolet lithography mask stack were characterized by force-distance spectroscopy after cleaning Al2O3 layers using a laser induced plasma (LIP) shock wave. The adhesion force of the Al2O3 surface decreased at a higher laser energy and a lower gap distance above a threshold gap distance without changes in surface roughness. Frictional electrostatic repulsion, tribo-electricity, was identified as the cause of lower adhesion forces on Al2O3 surface due to the high velocity and pressure of the LIP shock waves. The adhesion force decreased by increasing the number of exposures of LIP shock waves to the substrate. (c) 2008 Elsevier B.V. All rights reserved. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | Elsevier BV | - |
dc.title | Adhesion force change on multilayer EUVL mask due to laser induced plasma shock wave | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Park, Jin-Goo | - |
dc.identifier.doi | 10.1016/j.mee.2008.10.016 | - |
dc.identifier.scopusid | 2-s2.0-58149214150 | - |
dc.identifier.wosid | 000263780500007 | - |
dc.identifier.bibliographicCitation | Microelectronic Engineering, v.86, no.2, pp.150 - 154 | - |
dc.relation.isPartOf | Microelectronic Engineering | - |
dc.citation.title | Microelectronic Engineering | - |
dc.citation.volume | 86 | - |
dc.citation.number | 2 | - |
dc.citation.startPage | 150 | - |
dc.citation.endPage | 154 | - |
dc.type.rims | ART | - |
dc.type.docType | Article; Proceedings Paper | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Optics | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Optics | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | NANOPARTICLE REMOVAL | - |
dc.subject.keywordPlus | PARTICLE REMOVAL | - |
dc.subject.keywordPlus | SILICON-WAFERS | - |
dc.subject.keywordAuthor | Adhesion force | - |
dc.subject.keywordAuthor | Extreme ultraviolet lithography | - |
dc.subject.keywordAuthor | EUVL | - |
dc.subject.keywordAuthor | Mask | - |
dc.subject.keywordAuthor | Laser shock wave cleaning | - |
dc.subject.keywordAuthor | Laser induced plasma shock wave | - |
dc.subject.keywordAuthor | Force-distance spectroscopy | - |
dc.subject.keywordAuthor | Alumina thin film | - |
dc.identifier.url | https://www.sciencedirect.com/science/article/pii/S0167931708004620?via%3Dihub | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
55 Hanyangdeahak-ro, Sangnok-gu, Ansan, Gyeonggi-do, 15588, Korea+82-31-400-4269 sweetbrain@hanyang.ac.kr
COPYRIGHT © 2021 HANYANG UNIVERSITY. ALL RIGHTS RESERVED.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.