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Highly Compact Interconnect Test Patterns for Crosstalk and Static Faults

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dc.contributor.authorSong, Jaehoon-
dc.contributor.authorHan, Juhee-
dc.contributor.authorYi, Hyunbean-
dc.contributor.authorJung, Taejin-
dc.contributor.authorPark, Sungju-
dc.date.accessioned2021-06-23T16:03:43Z-
dc.date.available2021-06-23T16:03:43Z-
dc.date.issued2009-01-
dc.identifier.issn1549-7747-
dc.identifier.issn1558-3791-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/41460-
dc.description.abstractThe effect of crosstalk-induced errors becomes more significant in high-performance circuits and systems. In this paper, compact crosstalk test patterns are introduced for a system-on-a-chip and board level interconnects considering physically effective aggressors. By being able to target multiple victim lines, 6n, where n is the number of nets patterns are drastically reduced to a constant number 6D, where D indicates the effective distance among interconnect nets. The test quality for static and crosstalk faults are completely preserved with 6D patterns.-
dc.format.extent5-
dc.language영어-
dc.language.isoENG-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.titleHighly Compact Interconnect Test Patterns for Crosstalk and Static Faults-
dc.typeArticle-
dc.publisher.location미국-
dc.identifier.doi10.1109/TCSII.2008.2010168-
dc.identifier.scopusid2-s2.0-59649103625-
dc.identifier.wosid000262713100012-
dc.identifier.bibliographicCitationIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, v.56, no.1, pp 56 - 60-
dc.citation.titleIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS-
dc.citation.volume56-
dc.citation.number1-
dc.citation.startPage56-
dc.citation.endPage60-
dc.type.docTypeArticle-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.subject.keywordAuthorCrosstalk faults-
dc.subject.keywordAuthorinterconnect test-
dc.subject.keywordAuthorstatic faults-
dc.subject.keywordAuthorsystem-on-a-chip (SoC)-
dc.subject.keywordAuthortest pattern-
dc.identifier.urlhttps://ieeexplore.ieee.org/document/4753705-
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