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Highly Compact Interconnect Test Patterns for Crosstalk and Static Faults

Authors
Song, JaehoonHan, JuheeYi, HyunbeanJung, TaejinPark, Sungju
Issue Date
Jan-2009
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Keywords
Crosstalk faults; interconnect test; static faults; system-on-a-chip (SoC); test pattern
Citation
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, v.56, no.1, pp 56 - 60
Pages
5
Indexed
SCIE
SCOPUS
Journal Title
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS
Volume
56
Number
1
Start Page
56
End Page
60
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/41460
DOI
10.1109/TCSII.2008.2010168
ISSN
1549-7747
1558-3791
Abstract
The effect of crosstalk-induced errors becomes more significant in high-performance circuits and systems. In this paper, compact crosstalk test patterns are introduced for a system-on-a-chip and board level interconnects considering physically effective aggressors. By being able to target multiple victim lines, 6n, where n is the number of nets patterns are drastically reduced to a constant number 6D, where D indicates the effective distance among interconnect nets. The test quality for static and crosstalk faults are completely preserved with 6D patterns.
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COLLEGE OF COMPUTING > SCHOOL OF COMPUTER SCIENCE > 1. Journal Articles

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