Highly Compact Interconnect Test Patterns for Crosstalk and Static Faults
- Authors
- Song, Jaehoon; Han, Juhee; Yi, Hyunbean; Jung, Taejin; Park, Sungju
- Issue Date
- Jan-2009
- Publisher
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
- Keywords
- Crosstalk faults; interconnect test; static faults; system-on-a-chip (SoC); test pattern
- Citation
- IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, v.56, no.1, pp 56 - 60
- Pages
- 5
- Indexed
- SCIE
SCOPUS
- Journal Title
- IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS
- Volume
- 56
- Number
- 1
- Start Page
- 56
- End Page
- 60
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/41460
- DOI
- 10.1109/TCSII.2008.2010168
- ISSN
- 1549-7747
1558-3791
- Abstract
- The effect of crosstalk-induced errors becomes more significant in high-performance circuits and systems. In this paper, compact crosstalk test patterns are introduced for a system-on-a-chip and board level interconnects considering physically effective aggressors. By being able to target multiple victim lines, 6n, where n is the number of nets patterns are drastically reduced to a constant number 6D, where D indicates the effective distance among interconnect nets. The test quality for static and crosstalk faults are completely preserved with 6D patterns.
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Collections - COLLEGE OF COMPUTING > SCHOOL OF COMPUTER SCIENCE > 1. Journal Articles

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