Adhesion and removal of silica and ceria particles on the wafer surfaces in STI and poly Si CMP
DC Field | Value | Language |
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dc.contributor.author | Hong, Yi-Koan | - |
dc.contributor.author | Kang, Young Jae | - |
dc.contributor.author | Park, Jin-Goo | - |
dc.contributor.author | Han, Sang Yeob | - |
dc.contributor.author | Yun, Seong Kyu | - |
dc.contributor.author | Yoon, Bo Un | - |
dc.contributor.author | Hong, Chang Ki | - |
dc.date.accessioned | 2021-06-23T18:40:27Z | - |
dc.date.available | 2021-06-23T18:40:27Z | - |
dc.date.issued | 2008-00 | - |
dc.identifier.issn | 1012-0394 | - |
dc.identifier.issn | 1662-9779 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/43060 | - |
dc.description.abstract | The purpose of this study is to investigate the effects of slurry pH on the adhesion and removal of silica and ceria abrasive particles on the poly Si, TEOS, SiN and SAC (self aligned memory cell contact) and STI (shallow trench isolation) patterned wafer surfaces. The adhesion force of silica and ceria particles were theoretically and experimentally investigated in STI and poly Si CMP process. A stronger adhesion force was observed for silica particles on the poly Si wafer in acidic rather than in alkaline solutions. The adhesion force of ceria particle was lower than that of silica in investigated pH ranges. STI patterned wafer showed lower adhesion force than SAC patterned wafer. Lower adhesion force between particles and surface resulted in a lower level of particle contamination. © (2008) Trans Tech Publications, Switzerland. | - |
dc.format.extent | 5 | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | Scitec Publications Ltd. | - |
dc.title | Adhesion and removal of silica and ceria particles on the wafer surfaces in STI and poly Si CMP | - |
dc.type | Article | - |
dc.publisher.location | 스위스 | - |
dc.identifier.doi | 10.4028/www.scientific.net/SSP.134.159 | - |
dc.identifier.scopusid | 2-s2.0-38549097126 | - |
dc.identifier.wosid | 000253389300036 | - |
dc.identifier.bibliographicCitation | Solid State Phenomena, v.134, pp 159 - 163 | - |
dc.citation.title | Solid State Phenomena | - |
dc.citation.volume | 134 | - |
dc.citation.startPage | 159 | - |
dc.citation.endPage | 163 | - |
dc.type.docType | Conference Paper | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | Abrasives | - |
dc.subject.keywordPlus | Adhesion | - |
dc.subject.keywordPlus | Alkalinity | - |
dc.subject.keywordPlus | Alumina | - |
dc.subject.keywordPlus | Aluminum oxide | - |
dc.subject.keywordPlus | Cerium oxide | - |
dc.subject.keywordPlus | Polycrystalline materials | - |
dc.subject.keywordPlus | Silica | - |
dc.subject.keywordPlus | Silicon nitride | - |
dc.subject.keywordPlus | Abrasive particles | - |
dc.subject.keywordPlus | Adhesion forces | - |
dc.subject.keywordPlus | Alkaline solutions | - |
dc.subject.keywordPlus | Alumina particles | - |
dc.subject.keywordPlus | Particle contamination | - |
dc.subject.keywordPlus | Patterned wafers | - |
dc.subject.keywordPlus | Shallow trench isolation | - |
dc.subject.keywordPlus | Silica particles | - |
dc.subject.keywordPlus | Silicon wafers | - |
dc.subject.keywordAuthor | Adhesion force | - |
dc.subject.keywordAuthor | Alumina particle | - |
dc.subject.keywordAuthor | Cu CMP | - |
dc.identifier.url | https://www.scientific.net/SSP.134.159 | - |
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