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The dependence of chemical mechanical polishing residue removal on post-cleaning treatments

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dc.contributor.authorChoi, Jae Gon-
dc.contributor.authorYoon, Hyo Geun-
dc.contributor.authorKim, Woo Jin-
dc.contributor.authorChoi, Geun Min-
dc.contributor.authorSong, Young Wook-
dc.contributor.authorPark, Jin-Goo-
dc.date.accessioned2021-06-23T18:40:36Z-
dc.date.available2021-06-23T18:40:36Z-
dc.date.issued2008-00-
dc.identifier.issn1012-0394-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/43064-
dc.description.abstract[No abstract available]-
dc.format.extent4-
dc.language영어-
dc.language.isoENG-
dc.publisherTrans Tech Publications Ltd-
dc.titleThe dependence of chemical mechanical polishing residue removal on post-cleaning treatments-
dc.typeArticle-
dc.publisher.location스위스-
dc.identifier.doi10.4028/www.scientific.net/SSP.134.303-
dc.identifier.scopusid2-s2.0-38549118940-
dc.identifier.wosid000253389300070-
dc.identifier.bibliographicCitationSolid State Phenomena, v.134, pp 303 - 306-
dc.citation.titleSolid State Phenomena-
dc.citation.volume134-
dc.citation.startPage303-
dc.citation.endPage306-
dc.type.docTypeConference Paper-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.subject.keywordAuthorAnd defect-
dc.subject.keywordAuthorCleaning-
dc.subject.keywordAuthorCMP process-
dc.subject.keywordAuthorDishing effect-
dc.subject.keywordAuthorEtching rate-
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COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING > 1. Journal Articles

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