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Electromigration effect of Ni electrodes on the resistive switching characteristics of NiO thin films

Authors
Lee, C. B.Kang, B. S.Lee, M. J.Ahn, S. E.Stefanovich, G.Xianyu, W. X.Kim, K. H.Hur, J. H.Yin, H. X.Park, Y.Yoo, I. K.Park, J.-B.Park, B. H.
Issue Date
Aug-2007
Publisher
AMER INST PHYSICS
Keywords
MEMORY APPLICATIONS; OXIDE-FILMS; INTERFACE
Citation
APPLIED PHYSICS LETTERS, v.91, no.8, pp 1 - 4
Pages
4
Indexed
SCIE
SCOPUS
Journal Title
APPLIED PHYSICS LETTERS
Volume
91
Number
8
Start Page
1
End Page
4
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/43489
DOI
10.1063/1.2769759
ISSN
0003-6951
1077-3118
Abstract
The effects of Ni and Ni0.83Pt0.17 alloy electrodes on the resistance switching of the dc-sputtered polycrystalline NiO thin films were investigated. The initial off-state resistances of the films were similar to that of Pt/NiO/Pt film. However, after the first cycle of switching, the off-state resistance significantly decreased in the films with Ni in the electrode. It can be attributed to the migration of Ni from electrodes to the NiO films. The improvement in data dispersion of switching parameters is explained in terms of the decrease of the effective thickness of the films resulting from the migration of Ni.
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ERICA 첨단융합대학 (ERICA 지능정보양자공학전공)
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