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Anisotropic resist reflow process simulation for 32 nm node elongated contact holes

Authors
Park, Joon-MinKim, Dai-GyoungHong, Joo-YooOh, Hye-Keun
Issue Date
Nov-2007
Publisher
IEEE
Keywords
32 nm pattern; Elongated contact hole; Optical proximity correction; Resist reflow process
Citation
Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC, pp.90 - 91
Indexed
SCOPUS
Journal Title
Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC
Start Page
90
End Page
91
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/44280
DOI
10.1109/IMNC.2007.4456119
Abstract
In general, it is very hard to correctly predict the elongated contact hole resist reflow process ( CH RRP) due to position shift and pattern size irregularity of RRP, because simple RRP simulator uses isotropic resist flow. Therefore RRP simulator was upgraded which can correctly predict the elongated CH RRP by adding the bulk effect and anisotropic reflow. Optical proximity correction for 32 nm node was also applied to the elongated CH RRP to correctly predict the anisotropic elongated CH. The experimental and simulated CH patterns after RRP were compared and found that the simulator can correctly predict the behavior of complex CH array after RRP.
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COLLEGE OF SCIENCE AND CONVERGENCE TECHNOLOGY > DEPARTMENT OF APPLIED PHYSICS > 1. Journal Articles
COLLEGE OF SCIENCE AND CONVERGENCE TECHNOLOGY > ERICA 수리데이터사이언스학과 > 1. Journal Articles

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Kim, Dai-Gyoung
ERICA 과학기술융합대학 (ERICA 수리데이터사이언스학과)
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