Design and fabrication of a transmitter optical subassembly (TOSA) in 10-Gb/s small-form-factor pluggable (XFP) transceiver
DC Field | Value | Language |
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dc.contributor.author | Kim, Dongchurl | - |
dc.contributor.author | Shim, Jongin | - |
dc.contributor.author | Keh, Yong-Chan | - |
dc.contributor.author | Park, Munkyu | - |
dc.date.accessioned | 2021-06-23T21:38:43Z | - |
dc.date.available | 2021-06-23T21:38:43Z | - |
dc.date.created | 2021-01-21 | - |
dc.date.issued | 2006-07 | - |
dc.identifier.issn | 1077-260X | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/44786 | - |
dc.description.abstract | A smart and compact packaging transmitter optical subassembly. (TOSA) in a 10-Gb/s small-form-factor pluggable (XFP) transceiver module has been developed with an eye towards electrical and thermal performances. In the TOSA, a bias-tee circuit and a matching resistor are monolithically integrated on an AIN submount with high thermal conductivity, and a newly proposed coplanar waveguide is drawn in a transistor outline (TO)-stem. In order to improve the electrical performance of the TOSA, the equivalent circuit model of all optoelectronic components in the TOSA is introduced and utilized. The fabricated TOSA shows the -3-dB bandwidth as high as 11 GHz and 0.36-dB penalty after a 75-km transmission at an elevated temperature of 85 degrees C. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | Institute of Electrical and Electronics Engineers | - |
dc.title | Design and fabrication of a transmitter optical subassembly (TOSA) in 10-Gb/s small-form-factor pluggable (XFP) transceiver | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Shim, Jongin | - |
dc.identifier.doi | 10.1109/JSTQE.2006.876184 | - |
dc.identifier.scopusid | 2-s2.0-33747290659 | - |
dc.identifier.wosid | 000239745000036 | - |
dc.identifier.bibliographicCitation | IEEE Journal on Selected Topics in Quantum Electronics, v.12, no.4, pp.776 - 782 | - |
dc.relation.isPartOf | IEEE Journal on Selected Topics in Quantum Electronics | - |
dc.citation.title | IEEE Journal on Selected Topics in Quantum Electronics | - |
dc.citation.volume | 12 | - |
dc.citation.number | 4 | - |
dc.citation.startPage | 776 | - |
dc.citation.endPage | 782 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalResearchArea | Optics | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Quantum Science & Technology | - |
dc.relation.journalWebOfScienceCategory | Optics | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | RIDGE-WAVE-GUIDE | - |
dc.subject.keywordPlus | HIGH-SPEED | - |
dc.subject.keywordPlus | BURIED HETEROSTRUCTURE | - |
dc.subject.keywordPlus | EXTRACTION | - |
dc.subject.keywordAuthor | distributed feedback laser diode (DFB-LD) | - |
dc.subject.keywordAuthor | 10-Gb/s-small-form-factor pluggable (XFP) | - |
dc.subject.keywordAuthor | semiconductor device packaging | - |
dc.subject.keywordAuthor | transmitter optical subassembly (TOSA) | - |
dc.identifier.url | https://ieeexplore.ieee.org/document/1668122 | - |
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