Highly integrated 10Gb/s optical sub-assembly and its circuit modeling
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Shim, Jong In | - |
dc.contributor.author | Kim, D. | - |
dc.date.accessioned | 2021-06-23T22:38:55Z | - |
dc.date.available | 2021-06-23T22:38:55Z | - |
dc.date.issued | 2006-10 | - |
dc.identifier.issn | 0277-786X | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/45360 | - |
dc.description.abstract | A highly integrated 10 Gb/s transmitter optical sub-assembly was fabricated and characterized for XFP transceiver. As a light source, uncooled 1.3 μm high-speed distributed feedback laser diode (DFB-LD) was fabricated and assembled on AlN sub-mount with a monitoring PD, a matching-resistor, and a bias-Tee with spiral-inductor. A glass sealed metallic low-loss TO-stem with in-line leads was newly presented. We developed a small-signal equivalent circuit model based on measured S-parameters in order to verify RF characteristics of LD and passive components. The eye-diagram of 10 Gb/s NRZ patterns with a PRBS 231-1 was opened clearly without mask violation. At 85°C, -3-dB bandwidth was measured as high as 11 GHz and 75-km transmission was successfully achieved with very low penalty. | - |
dc.format.extent | 8 | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | SPIE | - |
dc.title | Highly integrated 10Gb/s optical sub-assembly and its circuit modeling | - |
dc.type | Article | - |
dc.publisher.location | 미국 | - |
dc.identifier.doi | 10.1117/12.687391 | - |
dc.identifier.scopusid | 2-s2.0-33845659915 | - |
dc.identifier.bibliographicCitation | Proceedings of SPIE - The International Society for Optical Engineering, v.6352 I, pp 1 - 8 | - |
dc.citation.title | Proceedings of SPIE - The International Society for Optical Engineering | - |
dc.citation.volume | 6352 I | - |
dc.citation.startPage | 1 | - |
dc.citation.endPage | 8 | - |
dc.type.docType | Conference Paper | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scopus | - |
dc.subject.keywordPlus | Distributed feedback lasers | - |
dc.subject.keywordPlus | Electronics packaging | - |
dc.subject.keywordPlus | Integrated circuits | - |
dc.subject.keywordPlus | Light sources | - |
dc.subject.keywordPlus | Semiconductor devices | - |
dc.subject.keywordPlus | Transceivers | - |
dc.subject.keywordPlus | Distributed feedback laser diode (DFB-LD) | - |
dc.subject.keywordPlus | Semiconductor device packaging | - |
dc.subject.keywordPlus | Small form factor pluggable (XFP) | - |
dc.subject.keywordPlus | Transmitter optical sub-assemble (TOSA) | - |
dc.subject.keywordPlus | Integrated optics | - |
dc.subject.keywordAuthor | 10 Gb/s small form factor pluggable (XFP) | - |
dc.subject.keywordAuthor | Distributed feedback laser diode (DFB-LD) | - |
dc.subject.keywordAuthor | Semiconductor device packaging | - |
dc.subject.keywordAuthor | Transmitter optical sub-assemble (TOSA) | - |
dc.identifier.url | https://www.spiedigitallibrary.org/conference-proceedings-of-spie/6352/1/Highly-integrated-10Gb-s-optical-sub-assembly-and-its-circuit/10.1117/12.687391.short | - |
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