Simulator for resist-reflow process by boundary movement

Abstract

The thermal-reflow process is one of many processes used for pattern shrinkage and resolution-enhancement technology. In this study, resist-flow behavior and contact-hole shrinkage are described by using the thermal-reflow length of the boundary-movement method and analysis of the image process. For the boundary-movement method, the viscosity variable is extracted from the experimental data by using a proposed equation. The simulation results of the boundary-movement method agree well with the experimental results in both contact-hole sizes and vertical-wall profile according to the baking temperature and time. The most controllable process and parameter for the critical dimension in thermal reflow are the development process and the inhibition reaction order of the enhanced Mack model.