A New TWA based Efficient Signal Integrity Verification Technique for Non-Uniform RLC Interconnect Lines

Abstract

A new TWA-based signal integrity verification technique for practical layout structures which are composed of non-uniform RLC lines with various discontinuities is presented. Transforming the non-uniform lines into virtual uniform lines, signal integrity of the practical layout structures can be very efficiently estimated by using the TWA-technique. It is shown that the proposed technique can estimate the signal integrity much more efficiently than generic SPICE model within 5% error.