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Application of data mining for improving yield in wafer fabrication system

Authors
Baek, Dong HyunJeong, In-JaeHan, Chang Hee
Issue Date
May-2005
Publisher
SPRINGER-VERLAG BERLIN
Keywords
Control Chart; Data Mining Technique; Process Capability Index; Wafer Fabrication; Statistical Quality Control
Citation
COMPUTATIONAL SCIENCE AND ITS APPLICATIONS - ICCSA 2005, VOL 4, PROCEEDINGS, v.3483, no.4, pp.222 - 231
Indexed
OTHER
Journal Title
COMPUTATIONAL SCIENCE AND ITS APPLICATIONS - ICCSA 2005, VOL 4, PROCEEDINGS
Volume
3483
Number
4
Start Page
222
End Page
231
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/46162
DOI
10.1007/11424925_25
ISSN
0302-9743
Abstract
This paper presents a comprehensive and successful application of data mining methodologies to improve wafer yield in a semiconductor wafer fabrication system. To begin with, this paper applies a clustering method to automatically identify AUF (Area Uniform Failure) phenomenon from data instead of visual inspection that bad chips occurs in a specific area of wafer. Next, sequential pattern analysis and classification methods are applied to find out machines and parameters that are cause of low yield, respectively. Finally, this paper demonstrates an information system, Y2R-PLUS (Yield Rapid Ramp-up, Prediction, analysis & Up Support) that is developed in order to analyze wafer yield in a Korea semiconductor manufacturer.
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