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A fabrication of DC-DC converter using LTCC NiZnCu ferrite thick films

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dc.contributor.authorMoon, K.W.-
dc.contributor.authorHong, S.H.-
dc.contributor.authorKim, H.J.-
dc.contributor.authorKim, J.-
dc.date.accessioned2021-06-24T00:07:36Z-
dc.date.available2021-06-24T00:07:36Z-
dc.date.issued2005-10-
dc.identifier.issn2150-4598-
dc.identifier.issn2150-4601-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/46439-
dc.description.abstractThe application of low temperature co-fired ceramics (LTCC) technology to ferrite has attracted much attention because LTCC can offer a high density of electronic components and interconnection possibilities in one multichip module package. In this regard, an experiment was conducted to fabricate a DC-DC converter using LTCC technology. Thick films were prepared by grinding calcined powders by wet ball milling and mixing binder, plasticizer, dispersant and solvent. Ferrite thick films were then fabricated using a doctor blade method. Experimental results clearly indicate that the ferrite thick film is suitable for LTCC application.-
dc.format.extent1-
dc.language영어-
dc.language.isoENG-
dc.publisherIEEE Computer Society-
dc.titleA fabrication of DC-DC converter using LTCC NiZnCu ferrite thick films-
dc.typeArticle-
dc.publisher.location미국-
dc.identifier.doi10.1109/intmag.2005.1463984-
dc.identifier.scopusid2-s2.0-28444432347-
dc.identifier.bibliographicCitationINTERMAG ASIA 2005: Digests of the IEEE International Magnetics Conference, pp 555 - 555-
dc.citation.titleINTERMAG ASIA 2005: Digests of the IEEE International Magnetics Conference-
dc.citation.startPage555-
dc.citation.endPage555-
dc.type.docTypeConference Paper-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscopus-
dc.subject.keywordPlusFabrication-
dc.subject.keywordPlusDC-DC power converters-
dc.subject.keywordPlusFerrites-
dc.subject.keywordPlusThick films-
dc.subject.keywordPlusTemperature-
dc.subject.keywordPlusCeramics-
dc.subject.keywordPlusElectronic components-
dc.subject.keywordPlusMultichip modules-
dc.subject.keywordPlusElectronics packaging-
dc.subject.keywordPlusPowders-
dc.identifier.urlhttps://ieeexplore.ieee.org/document/1463984-
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