Fabrication of a patterned replica by hot embossing on various thicknesses of PMMA

Abstract

We investigated the possibility of using hot embossing for polymer-based flexible substrates. A Si mold had a mixture of patterns from 1 μm to 500 μm width and was imprinted on various thicknesses of PMMA. To obtain a good release process between the mold and replica, an antistiction layer was coated on the mold. All procedures were conducted in a clean room to ensure a particle-free result. Printing conditions were optimized as functions of process pressure and temperature plotted and calculated. Thin layers need a higher temperature and pressure than thick layers. The mold structures were successfully replicated into a PMMA substrate over the area of a 4-inch wafer.