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The extraction of develop parameters by using cross-sectional critical shape error method

Authors
Kim, Hyoung-HeePark, Jun-TackChoi, Jung-WookAn, IlsinOh, Hye-Keun
Issue Date
Jun-2004
Publisher
IOP Publishing Ltd
Keywords
lithography; CCSE; development; develop parameter; chemically amplified resist; SEM
Citation
Japanese Journal of Applied Physics, v.43, no.6B, pp 3692 - 3694
Pages
3
Indexed
SCIE
SCOPUS
Journal Title
Japanese Journal of Applied Physics
Volume
43
Number
6B
Start Page
3692
End Page
3694
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/46585
DOI
10.1143/JJAP.43.3692
ISSN
0021-4922
1347-4065
Abstract
As the minimum feature size decreases, the gap between real experimental lithography process and simulated one increases. This gap should be reduced as small as possible by inserting the correct process parameters to simulation. Unfortunately, we do not have the exact simulation parameters in most cases and we need to get more accurate parameters. Among many methods to obtain the exact parameters, we used a new automatic cross-sectional critical shape error method to get the develop parameters by comparing the experimental scanning electron microscope image with the simulated image. This new bitmap masking technique is much faster than the conventional serial cross-sectional critical shape error method.
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COLLEGE OF SCIENCE AND CONVERGENCE TECHNOLOGY > DEPARTMENT OF APPLIED PHYSICS > 1. Journal Articles
COLLEGE OF SCIENCE AND CONVERGENCE TECHNOLOGY > DEPARTMENT OF PHOTONICS AND NANOELECTRONICS > 1. Journal Articles

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