A 3D Numerical Study of the Polishing Behavior during an Oxide Chemical Mechanical Planarization Process
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Donghun | - |
dc.contributor.author | Kwon, D.J. | - |
dc.contributor.author | Hong, Yi Koan | - |
dc.contributor.author | Park, Jin Goo | - |
dc.date.accessioned | 2021-06-24T00:41:30Z | - |
dc.date.available | 2021-06-24T00:41:30Z | - |
dc.date.issued | 2004-02 | - |
dc.identifier.issn | 1013-9826 | - |
dc.identifier.issn | 1662-9795 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/46627 | - |
dc.description.abstract | The slurry fluid motion, abrasive particle motion, and roles of groove patterns on the pads are numerically investigated in 2D and 3D geometries. The simulation results were analyzed in terms of experimental removal rate and WIWNU (within wafer non-uniformity) for ILD (inter level dielectric) CMP process. Numerical investigations revealed that the grooves in the pad behave as the uniform distributor of abrasive particles and enhance the removal rate by increasing shear stress. Higher removal rate and desirable uniformity are numerically and experimentally observed at the pad with grooves. Numerical analysis results matched very well with the experimental results and are useful for understanding the polishing mechanism and local physics. | - |
dc.format.extent | 6 | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | Trans Tech Publications Ltd. | - |
dc.title | A 3D Numerical Study of the Polishing Behavior during an Oxide Chemical Mechanical Planarization Process | - |
dc.type | Article | - |
dc.publisher.location | 스위스 | - |
dc.identifier.doi | 10.4028/www.scientific.net/KEM.257-258.433 | - |
dc.identifier.scopusid | 2-s2.0-17644437533 | - |
dc.identifier.wosid | 000228297900073 | - |
dc.identifier.bibliographicCitation | Key Engineering Materials, v.257-258, pp 433 - 438 | - |
dc.citation.title | Key Engineering Materials | - |
dc.citation.volume | 257-258 | - |
dc.citation.startPage | 433 | - |
dc.citation.endPage | 438 | - |
dc.type.docType | Article | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Ceramics | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Composites | - |
dc.subject.keywordPlus | Abrasives | - |
dc.subject.keywordPlus | Computational fluid dynamics | - |
dc.subject.keywordPlus | Computer simulation | - |
dc.subject.keywordPlus | Finite volume method | - |
dc.subject.keywordPlus | Integrated circuit manufacture | - |
dc.subject.keywordPlus | Navier Stokes equations | - |
dc.subject.keywordPlus | Numerical analysis | - |
dc.subject.keywordPlus | Slurries | - |
dc.subject.keywordPlus | Chemical mechanical planarization | - |
dc.subject.keywordPlus | CMP | - |
dc.subject.keywordPlus | Incompressible Navier Stokes equation | - |
dc.subject.keywordPlus | Pad | - |
dc.subject.keywordPlus | Slurry fluid motion | - |
dc.subject.keywordPlus | Polishing | - |
dc.subject.keywordAuthor | chemical mechanical planarization | - |
dc.subject.keywordAuthor | CMP | - |
dc.subject.keywordAuthor | pad | - |
dc.subject.keywordAuthor | finite volume methods | - |
dc.subject.keywordAuthor | FVM | - |
dc.subject.keywordAuthor | computational fluid dynamics | - |
dc.subject.keywordAuthor | CFD | - |
dc.subject.keywordAuthor | incompressible Navier-Stokes equation | - |
dc.identifier.url | https://www.scientific.net/KEM.257-258.433 | - |
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