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Electrochemical kinetics study of electroless copper plating for electronics application
- Authors
- Kim, Dae-Geun; Bae, Jin-Soo; Lee, Jae-Ho; Kim, Yangdo; Ahn, Yoomin
- Issue Date
- Mar-2004
- Publisher
- Trans Tech Publications Ltd.
- Keywords
- electroless copper plating; mixed potential; additive
- Citation
- Materials Science Forum, v.449-452, pp 393 - 396
- Pages
- 4
- Indexed
- SCOPUS
- Journal Title
- Materials Science Forum
- Volume
- 449-452
- Start Page
- 393
- End Page
- 396
- ISSN
- 0255-5476
1662-9752
- Abstract
- Electroless copper plating was investigated for the electronics applications, such as a metallization for ULSI and MEMS etc. The role of electrolyte composition on the kinetics and mechanism of the electroless copper deposition process was described. Electrochemical techniques were employed for the investigations. The mixed potential and current were determined and then those were compared with experimental deposition rate. The kinetics is strongly influenced by the pretreatment and additive concentrations.
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Related Researcher
- Ahn, Yoomin
- ERICA 공학대학 (DEPARTMENT OF MECHANICAL ENGINEERING)