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Sensitivity of simulation parameter for critical dimension

Authors
Kim, SKOh, HK
Issue Date
Jun-2002
Publisher
IOP Publishing Ltd
Keywords
lithography; critical dimension; optimization; simulation parameters; response surface methodology
Citation
Japanese Journal of Applied Physics, v.41, no.6B, pp 4222 - 4227
Pages
6
Indexed
SCIE
SCOPUS
Journal Title
Japanese Journal of Applied Physics
Volume
41
Number
6B
Start Page
4222
End Page
4227
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/46812
DOI
10.1143/JJAP.41.4222
ISSN
0021-4922
1347-4065
Abstract
In this study, lithography processes were modeled and simulated for the optimized parameters of 365 nm, 248 nm, and 193 nm resists. Also, sensitivity of those parameters for the critical dimension (CD) and side wall angle of simulated Profile,, Was analyzed using the response surface methodology (RSM). Through the quantization of sensitivity of these easy-to-optimize simulation parameters, we quantified lithography processes and discussed the different phenomenon of the chemically amplified resist (CAR) compared to the non-CAR. To validate our results, the quantitative comparison between our results and those of a commercial tool was shown.
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COLLEGE OF SCIENCE AND CONVERGENCE TECHNOLOGY > DEPARTMENT OF APPLIED PHYSICS > 1. Journal Articles

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