A partial scan design unifying structural analysis and testabilities
- Authors
- Park, Sungju
- Issue Date
- Dec-2001
- Publisher
- TAYLOR & FRANCIS LTD
- Citation
- INTERNATIONAL JOURNAL OF ELECTRONICS, v.88, no.12, pp.1237 - 1245
- Indexed
- SCIE
SCOPUS
- Journal Title
- INTERNATIONAL JOURNAL OF ELECTRONICS
- Volume
- 88
- Number
- 12
- Start Page
- 1237
- End Page
- 1245
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/46873
- DOI
- 10.1080/00207210110093103
- ISSN
- 0020-7217
- Abstract
- To overcome the large extra hardware overhead attendant in full scan design, the concept of partial scan designs has emerged with the virtue of less area and testability close to full scan. Two typical partial scan techniques, based on structural analysis and testabilities, are widely adopted. The structural analysis requires less searching time, however in general the fault coverage is lower. On the other hand, the techniques using testabilities result in higher fault coverage, but require an extraordinary amount of searching time. In this paper we have analysed and unified the strength of techniques using structural analysis and testabilities. The new partial scan design proposed not only reduces the time for selecting scan flip-flop but also preserves high fault coverage. Test results demonstrate the high fault coverage and remarkable reduction in time for most ISCAS89 benchmark circuits.
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