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Characterization of undoped and Cu-doped ZnO films for surface acoustic wave applications

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dc.contributor.authorLee, Jin bock-
dc.contributor.authorLee, Hye jung-
dc.contributor.authorSeo, Soo hyung-
dc.contributor.authorPark, Jin seok-
dc.date.accessioned2021-06-24T01:04:29Z-
dc.date.available2021-06-24T01:04:29Z-
dc.date.created2021-01-21-
dc.date.issued2001-11-
dc.identifier.issn0040-6090-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/46876-
dc.description.abstractCu-doped ZnO (denoted by ZnO:Cu) films have been prepared by RF magnetron co-sputtering of a ZnO target with some Cu-chips attached. X-Ray diffraction (XRD) spectra of deposited ZnO:Cu films were measured and texture coefficient (TC) values for (002)-orientation were estimated. Optimal ranges of RF powers and substrate temperatures for obtaining high TC values were determined. Effects of Cu-doping conditions (such as Cu-chip sputtering areas and O-2/(Ar+O-2) mixing ratios) on TC values, electrical resistivities, and relative Cu-compositions of deposited films have been systematically investigated. X-Ray photoelectron spectroscopy (XPS) study suggests that the relative densities of metallic copper (Cu-0) atoms and CuO (Cu2+)-phases within deposited films may play an important role in determining their electrical resistivities. Highly resistive (> 10(10) Omega cm) ZnO films with high TC values (> 80%) can be achieved by Cu-doping. Surface acoustic wave (SAW) devices with ZnO:Cu (or ZnO)/interdigital transducer (IDT)/SiO2/Si configuration were also fabricated to estimate the effective electro-mechanical coupling coefficient (k(eff)(2)) and insertion loss. The devices using Cu-doped ZnO films have higher k(eff)(2), and lower insertion loss, compared with those using undoped films. (C) 2001 Elsevier Science B.V. All rights reserved.-
dc.language영어-
dc.language.isoen-
dc.publisherELSEVIER SCIENCE SA-
dc.titleCharacterization of undoped and Cu-doped ZnO films for surface acoustic wave applications-
dc.typeArticle-
dc.contributor.affiliatedAuthorPark, Jin seok-
dc.identifier.doi10.1016/S0040-6090(01)01332-3-
dc.identifier.scopusid2-s2.0-17544404553-
dc.identifier.wosid000172906200111-
dc.identifier.bibliographicCitationTHIN SOLID FILMS, v.398, pp.641 - 646-
dc.relation.isPartOfTHIN SOLID FILMS-
dc.citation.titleTHIN SOLID FILMS-
dc.citation.volume398-
dc.citation.startPage641-
dc.citation.endPage646-
dc.type.rimsART-
dc.type.docTypeArticle; Proceedings Paper-
dc.description.journalClass1-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryMaterials Science, Coatings & Films-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.relation.journalWebOfScienceCategoryPhysics, Condensed Matter-
dc.subject.keywordPlusTHIN-FILMS-
dc.subject.keywordPlusDEVICES-
dc.subject.keywordPlusDIAMOND-
dc.subject.keywordPlusCOPPER-
dc.subject.keywordPlusLINBO3-
dc.subject.keywordPlusMODE-
dc.subject.keywordAuthorCu-doped ZnO-
dc.subject.keywordAuthorRF magnetron sputtering-
dc.subject.keywordAuthorc-axis growth-
dc.subject.keywordAuthorelectrical resistivity-
dc.subject.keywordAuthorsurface acoustic wave-
dc.subject.keywordAuthorelectro-mechanical coupling coefficient-
dc.subject.keywordAuthorinsertion loss-
dc.identifier.urlhttps://www.sciencedirect.com/science/article/pii/S0040609001013323?via%3Dihub-
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ERICA 공학대학 (SCHOOL OF ELECTRICAL ENGINEERING)
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