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New technique for the thermal resistance measurement of power field effect transistors using cathodoluminescence

Authors
Kim, Hwa mokYoon, Jin sikLee, Seung hoOh, Jae eungLee, Won sangChun, Kye ikChung, Ki woongChung, Hae wonKang, Tae won
Issue Date
Nov-2000
Publisher
INST PURE APPLIED PHYSICS
Keywords
power FET; thermal resistance; high spatial resolution; low-energy electron-beam; cathodoluminescence; reliability
Citation
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, v.39, no.11A, pp.L1087 - L1089
Indexed
SCIE
SCOPUS
Journal Title
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS
Volume
39
Number
11A
Start Page
L1087
End Page
L1089
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/46939
DOI
10.1143/JJAP.39.L1087
ISSN
0021-4922
Abstract
A new approach for measuring the thermal resistance of power field-effect transistors (FETs) with extremely high spatial resolution below 40 nm has been demonstrated using cathodoluminescence generated by a low-energy electron beam. The energy shift of the fundamental bandgap caused by the current heating in the channel region is spatially probed, and is converted to the channel temperature using the temperature dependence of the material bandgap. The obtained thermal resistances of the GaAs metal semiconductor field effect transistor (MESFET) and the GaN MESFET are compared with those measured by the conventional electrical technique.
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COLLEGE OF ENGINEERING SCIENCES > SCHOOL OF ELECTRICAL ENGINEERING > 1. Journal Articles

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