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Electronic skin을 이용한 구조물 균열 감지
- Authors
- 장승환
- Issue Date
- 20-Apr-2021
- Place
- 제주 오리엔탈호텔
- Conference Name
- 2021 한국복합신소재구조학회 학술발표회
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Related Researcher
- Jang, Sung Hwan
- ERICA 공학대학 (DEPARTMENT OF CIVIL AND ENVIRONMENTAL ENGINEERING)